Fluorosilicone oil emempowerment brings performance upgrades to high-end applications of electronic devices


1. The packaging material has broken through the bottleneck of high-voltage endurance
Hydroxyl fluorosilicone oil-based packaging materials have recently achieved technological upgrades, with their dielectric strength increased to 22.6 kV/mm and a relative dielectric constant as low as below 2.8, performing outstandingly in high-voltage electronic devices such as IGBT modules. This material can operate stably for a long time within the temperature range of -60 ℃ to 250℃. After curing, its internal stress is reduced by 40% compared with traditional materials, effectively reducing the risk of cracking during the chip packaging process. Experiments show that the power module encapsulated with this material has an insulation performance degradation of less than 3% after continuous operation at 1500V for 1,000 hours, making it suitable for high-end scenarios such as inverters in new energy vehicles.

2. New progress has been made in flexible electronic protection technology
The flexible protective film developed based on vinyl fluorosilicone oil has been verified through bending tests. After being repeatedly bent at 180° for 10,000 times, it still maintains complete protective performance. This protective film features low water absorption (water absorption rate < 0.1%) and chemical corrosion resistance, capable of withstanding common erosions such as sweat and cleaning agents, while having a light transmittance of over 93%. It has been applied to flexible displays and wearable devices, reducing the failure rate of electronic components in damp environments by 70% and extending their service life to twice that of traditional protective materials.

3. Breakthroughs have been made in the thinning and lightness of electromagnetic shielding materials
The new fluorosilicone electromagnetic shielding composite material, through molecular structure optimization, achieves a shielding efficiency of over 45dB for electromagnetic waves in the 1-18GHz frequency band with a thickness of only 0.1mm. The core lies in the uniform dispersion technology of fluorosilicone oil and conductive fillers, which not only retains the temperature resistance of fluorosilicone materials (-50℃ to 200℃), but also solves the problem of the heaviness of traditional shielding materials. This material has been applied to high-frequency devices of 5G base stations, reducing electromagnetic interference of the equipment by 60% and significantly enhancing the stability of signal transmission.

4. The heat dissipation medium is compatible with the requirements of high-power devices
Methyl fluorosilicone oil-based thermal paste achieves a balance between thermal conductivity and stability, with the thermal conductivity coefficient increased to 3.2 W/(m · K), while maintaining a wide temperature range of -50 ° C to 200 ° C for use. In the server CPU heat dissipation test, the system temperature using this thermal paste was 12℃ lower than that of traditional products, and the performance degradation was less than 2% after continuous operation for 8,000 hours. Its low volatility (evaporation loss < 0.3%/100℃) also makes it suitable for the heat dissipation requirements of extreme environments such as space exploration equipment.