Polysilazane materials have triggered dual changes in high-temperature protection and the new energy sector


1.The high-temperature resistance performance has exceeded 1500℃, and the domestic production of aerospace materials is accelerating
The new type of polysilazonium alkyl composite material has performed astonishingly in extreme environmental tests, with its temperature resistance exceeding 1500℃, nearly ten times higher than that of traditional resin coatings. After being burned in an oxygen-acetylene flame at 1500℃ for 30 seconds, the mass loss of the material was only 0.8%, and the strength retention rate exceeded 90% after 100 thermal shock cycles (1200℃→ room temperature). The Si-N bond in its molecular structure is transformed into the Si₃N₄/SiC ceramic phase at high temperatures, forming a dense protective layer that effectively isolates oxygen erosion.
Previously, the high-end polysilazane technology was long monopolized by foreign countries, with a unit price as high as 3,000 yuan per kilogram. Through the independently developed liquid precursor conversion process in China, the cost has been reduced to 800 yuan per kilogram, and an annual production capacity of over 100 tons has been achieved. It has been applied to the protection of satellite solar panels and the thermal barrier system of hypersonic vehicles. It is expected that in the next five years, this material will replace 60% of the aviation silicone materials, and the market size will exceed 5 billion yuan.

2. Innovation in the field of new energy batteries: Upgrading of solid electrolyte and separator technologies
In the field of lithium batteries, breakthroughs have been made in the research and development of all-solid-state electrolyte membranes with polysilazane as the binder. Experimental data show that the ionic conductivity of the electrolyte membrane using a specific structure of polysilazane has been significantly improved, and its moisture resistance has been enhanced by more than 30% compared to traditional materials. Moreover, it maintains stable performance within the temperature range of -50 ℃ to 200℃. Meanwhile, the new separator technology composed of polysilazane and polyurethane enhances mechanical properties through hydrogen bonds, reducing the risk of thermal runaway of lithium batteries in high-temperature environments by 50%.
The polysilazane nanoparticles (OPSZ NPs) developed by a certain research team, when used as the anode material for lithium-ion batteries, achieved a specific capacity of 585.45mAh/g after 400 cycles at a current density of 1A/g, with a capacity attenuation of only 0.0172% per cycle, demonstrating excellent energy storage stability. This achievement provides crucial support for the commercialization of the next generation of high-energy-density batteries.

3. Technological innovation in environmentally friendly coatings has reduced the cost of full-scenario protection by 30%
Through the nano-alumina composite process, the polysilazane coating achieves the integration of three functions: high-temperature resistance, corrosion resistance and water resistance. Under high-temperature and high-humidity conditions, the dielectric properties of the coating remain stable, and its adhesion is more than twice that of traditional solutions. The protective mechanisms include the SiO₂ thermal barrier layer formed by the cleavage of silicon-nitrogen bonds, water vapor barrier of the organosilicon network, and chemical bonding between active groups and metal substrates.
Compared with the traditional laminated construction scheme, single-layer polysilazane coating can reduce maintenance costs by 30% and has been applied in extreme scenarios such as steel structures of offshore platforms and geothermal pipelines. The R&D team is currently working on room-temperature curing technology to expand its application in precision fields such as electronic device sealing.

4. Breakthroughs in semiconductor packaging and 3D printing technology
In the semiconductor field, polysilazane is used as a low dielectric constant material (k=2.5-3.0) in the silicon via (TSV) insulation layer of 2.5D/3D packaging, reducing signal delay by 15% compared to traditional polyimide. Its nanoscale flatness (film thickness uniformity ±3%) meets the high-frequency transmission requirements of 5G/6G and has achieved mid-to-low-end substitution in 3D NAND chip manufacturing.
In the field of additive manufacturing, a team from Shandong University of Technology has developed a highly photosensitive polysilazane precursor through chemical modification, achieving a ceramic yield of 79.92% and a linear shrinkage rate of 23.31%. They have successfully realized the light-curing 3D printing of SiCN ceramics, providing a new path for the preparation of complex structural components.