Polysiloxane technology promotes the upgrading of the medical and electronic industries
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Polysiloxane technology promotes the upgrading of the medical and electronic industries
1.Innovation in medical implants: Biocompatible polysiloxane materials
The new generation of biodegradable polysiloxane materials has achieved a key breakthrough in the medical field. The polysiloxane scaffold prepared by nano-modification technology has a mechanical strength of 120 mpa, which can match the stress requirements of human bones. Meanwhile, the degradation rate in simulated body fluids can be controlled within 6 to 12 months. In the field of wearable devices, carbon nanotube-polysiloxane composite sensors have been commercially applied. They can track indicators such as uric acid and lactic acid in sweat in real time in sports health monitoring, with a detection sensitivity of 0.1μM and a response time of less than 5 seconds. The biosafety of this type of material has been verified through hemolysis rate tests (<5%) and skin irritation experiments (no erythema reaction).
2.The heat dissipation problem of 2.5G communication equipment: The key role of polysiloxane materials
Uv-cured polysiloxane composites offer innovative solutions for the heat dissipation requirements of 5G base stations and consumer electronics. The 3D printed thermal conductive material developed by the team from Guangdong University of Technology achieves a thermal conductivity of 2.02 W/mK through an 82% filler load (6% BN + 76% Al₂O₃), which is 40% higher than that of traditional materials. This material uses mercaptopropyl functionalized polysiloxane as the matrix and combines multi-scale filler design. Under a heat source of 80℃, it can reduce the junction temperature of the chip by 18℃. In 5G base stations, this type of material has been used for RF module packaging, ensuring that the temperature fluctuation of the equipment is less than 2℃ after continuous operation for 48 hours.
3. New Options for electronic Packaging Materials: The Advantages of high-temperature resistant polysiloxane
In the field of the electronics industry, phenyl silicone resin packaging materials have demonstrated unique advantages. Its application proportion in LED packaging has reached 43.7%, and its UV resistance is five times better than that of traditional epoxy resin, with a yellowing index (ΔE) of less than 1.5. The application of addition-cured polysiloxane elastomers in automotive sensors has seen significant growth, with consumption reaching 193,000 tons in 2024, representing an annual growth rate of 12.8%. This type of material remains elastic within the temperature range of -60 ° C to 250 ° C and can withstand 10⁶ thermal cycles without cracking.
4. Research and Development Trends: The Latest Progress of polysiloxane in Flexible Electronics
A technological breakthrough has been achieved in the application of polysiloxane in the field of flexible electronics. The stretchable circuit developed through photoresponsive polysiloxane maintains a conductivity of 98% at 100% strain and has been used in the prototype design of flexible display driver circuits. The electromagnetic shielding phase change material developed by the team from South China University of Technology, combined with expanded graphite modified by silver nanoparticles, achieves a shielding efficiency of 73.2dB at a thickness of 2mm, and has a thermal conductivity of 23.4 W/mK, which can simultaneously solve the heat dissipation and electromagnetic interference problems of electronic devices. The flexibility of this type of material has been verified through 100,000 bending tests (with a curvature radius of 2mm), and the weight loss rate is less than 0.5%.