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In high-end scenarios such as advanced Chiplet packaging, silicon carbide epitaxy for third-generation semiconductors, and ultra-precision optical coating, electronic-grade hydrogen silicone oil is an irreplaceable process auxiliary material. It functions both as a reaction intermediate for synthesizing high-purity electronic-grade modified polysiloxanes and as an inert protective medium that provides uniform thermal conduction and anti-oxidation shielding during high-temperature vacuum processes such as chip bonding and wafer annealing. For a long period, domestic production capacity for semiconductor-grade hydrogen silicone oil was nearly zero, and all products meeting 12-inch wafer manufacturing standards were fully imported. These materials required constant-temperature sealed containers for transportation, complex customs clearance procedures, and extremely long lead times. Overseas suppliers historically enforced strict quota systems that severely limited purchase volumes for domestic semiconductor enterprises, directly constraining the expansion pace of China’s advanced packaging industry. As China’s third-generation semiconductor sector entered a boom period, annual SiC wafer production surged from 1.2 million pieces in 2023 to 4.7 million pieces in 2025, pushing annual demand for electronic-grade hydrogen silicone oil past 32,000 tons and creating an acute supply-demand imbalance. Against this backdrop, China’s first fully independent 10,000-ton all-process intelligent electronic-grade hydrogen silicone oil production line successfully passed its 72-hour full-load continuous operation assessment, marking the official large-scale stable supply of this once-bottleneck strategic material.
This new 10,000-ton line features a fully self-designed all-process dust-free closed-loop manufacturing architecture. From the moment raw materials enter the workshop, every operation is completed in inert-gas-protected sealed pipelines and reactors, with zero human contact with the material at any stage. In the raw material pretreatment section, a multi-stage series ion exchange and molecular distillation coupling process reduces metal ion impurities in the methyl hydrogen cyclosiloxane monomer to below 0.1ppb, preventing impurity introduction during subsequent polymerization from the very source. In the polymerization reactor section, an AI adaptive control system dynamically adjusts reaction temperature, pressure, and catalyst flow based on real-time molecular structure data collected by online mass spectrometers, ensuring that the molecular chain architecture of every batch remains highly consistent. At the final filling stage, a fully automatic nitrogen-purged filling system operates in a Class 100 cleanroom environment. All packaging containers undergo pre-treatment with plasma passivation, completely eliminating secondary contamination during packaging. The final electronic-grade hydrogen silicone oil delivered from the line achieves total metal impurities below 1ppb, with fewer than 10 particles larger than 0.1μm per milliliter, fully meeting SEMI Grade 1, the highest global standard for electronic materials.
The large-scale stable supply of domestic electronic-grade hydrogen silicone oil has already delivered remarkable results in the third-generation semiconductor industry. During the SiC epitaxial growth process, the inert silicon-hydrogen protective atmosphere generated by high-purity hydrogen silicone oil effectively prevents carbon precipitation on the epitaxial layer surface at temperatures exceeding 1600°C, drastically reducing threading dislocation defect density. Previously, using imported electronic-grade hydrogen silicone oil, the average yield of domestic 6-inch SiC epitaxial wafers hovered around 87%. After adopting the new domestic electronic-grade hydrogen silicone oil, surface defect density on epitaxial layers has decreased by 72%, and the overall yield of 6-inch SiC epitaxial wafers has jumped directly to 96.3%, reducing manufacturing costs per wafer by 28%. This development is directly accelerating the rapid cost decline of domestic automotive-grade SiC power devices. In the Chiplet advanced packaging sector, electronic-grade hydrogen silicone oil acts as a thermal transfer medium during vacuum reflow soldering, maintaining a temperature uniformity within ±0.8°C across the entire 200mm organic substrate. This solves the long-standing industry problem of unsynchronized solder joint melting during heterogeneous multi-die bonding, raising the 3D-stacked packaging solder joint yield from 95.1% to 99.5% and significantly cutting packaging costs for high-end AI accelerator chips.
The full-capacity operation of the 10,000-ton electronic-grade hydrogen silicone oil plant represents far more than a single product breakthrough. It symbolizes that China has now fully mastered the entire autonomous industrial chain, from upstream silica ore processing all the way down to the highest-grade electronic-grade silicone end products. For decades, China’s silicone industry was largely confined to mass production of mid-to-low-end commodity grades, while the global market share for high-value electronic and aerospace specialty silicone products was almost entirely controlled by overseas players. With the localization of full-spectrum high-grade hydrogen silicone oil, the product structure of China’s silicone industry is undergoing a fundamental transformation. The output value proportion of high-value specialty silicone products has surged from 11% in 2020 to 37% in 2025. As downstream applications continue to expand, domestic electronic-grade hydrogen silicone oil will further penetrate cutting-edge fields such as quantum chip packaging, high-temperature aerospace sealing, and nuclear fusion device core component lubrication. It will provide solid material support for the global competitiveness upgrade of China’s high-end manufacturing industry, driving the entire sector to achieve the historic leap from “scale advantage” to “technological leadership.”
