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In the third quarter of 2026, a heavyweight industrial progress was announced in China's high-end special organic silicone functional material sector: the new-generation full-series production line of high-activity low-chlorine epoxy-modified silicone oil, covering four core categories of high-transparency optical grade, high-toughness electronic grade, high-adhesion coating grade and low-dielectric-constant chip grade, has officially achieved stable full-load operation. The core indicators of the products, including the activity retention rate of epoxy groups, the control accuracy of hydrolyzable chlorine content and the crosslinking stability under extreme temperature and humidity environments, have comprehensively surpassed similar top-tier international products, completely breaking the nearly 50-year technological monopoly of overseas enterprises in this field. This fills a key link for the independent and controllable supply chain of China's strategically emerging industries such as advanced Chiplet packaging, third-generation semiconductor power device insulating potting and new-generation flexible display cover plate coating. As a special modified organic silicone material with epoxy functional groups directionally grafted on the polysiloxane molecular main chain, epoxy-modified silicone oil perfectly combines the low-temperature flexibility and weather resistance of polysiloxane with the high adhesion and high crosslinking strength of epoxy resin. It is a core functional substrate supporting performance upgrading in multiple high-end electronic manufacturing sub-tracks. The implementation of this full-series production capacity marks that China has achieved another leap from following to leading in the field of precise grafting regulation of special organic silicone molecular functional groups, providing independent and controllable underlying material support for the performance iteration of dozens of downstream high-end electronic new materials.
Looking back at the global industrial development course of epoxy-modified silicone oil, since the material realized laboratory synthesis in the 1970s, the core production technology has long been monopolized by a few overseas chemical giants. Due to the high probability of ring-opening side reactions of epoxy groups during the grafting process, traditional processes generally have common industry pain points such as large activity loss of epoxy groups, high hydrolyzable chlorine content of products and large batch-to-batch crosslinking performance fluctuation. For a very long time in the past, China could only produce low-to-medium end general-purpose epoxy-modified silicone oil in small batches, and the products were mainly applied in scenarios such as ordinary fabric finishing agents and low-end coating leveling agents, completely unable to meet the strict requirements of extreme working conditions in advanced electronic packaging and high-end optical coatings. Public industry data shows that before 2023, the import dependence of high-activity low-chlorine epoxy-modified silicone oil used in Chiplet chip packaging in China exceeded 97%. Overseas suppliers not only maintained the selling price of such special substrates at more than 21 times that of ordinary domestic products, but also frequently restricted supply by extending delivery cycles and setting purchase quotas. In 2024, a leading advanced packaging manufacturing enterprise in China was forced to reduce production of its new-generation 3D stacked chip production line for 11 days due to the supply interruption of this material, resulting in direct economic losses of more than 320 million yuan, and the supply chain security risk was very prominent.
The explosive growth of downstream emerging industries has directly driven the market demand expansion of epoxy-modified silicone oil. In 2025, the overall market size of China's epoxy-modified silicone oil reached 16.8 billion yuan, with a total output exceeding 420,000 tons, a year-on-year increase of 34.7%. Among them, high-purity special epoxy-modified silicone oil contributed more than 94% of the incremental demand. From the perspective of downstream demand structure, 41.2% of the demand comes from the field of advanced Chiplet chip packaging, 26.8% comes from the packaging scenario of third-generation semiconductor power devices, 15.3% comes from the field of new-generation flexible display cover plate coating, and the remaining demand is distributed in segmented tracks such as high-end electronic circuit board insulating coatings, toughening agents for new energy vehicle power battery structural adhesives and aerospace composite material interface modifiers. With the large-scale mass production of 12-inch 3D stacked chips in China, the production capacity of advanced packaging in China increased by 52% year-on-year in 2025, and the corresponding demand for low-chlorine high-activity epoxy-modified silicone oil increased by 73% year-on-year. At the same time, the capacity expansion of third-generation semiconductor silicon carbide devices in China is accelerating, new-generation foldable screen flexible display equipment is being implemented in batches, and high-end large aircraft composite materials have realized domestic substitution. The demand growth rate for high-purity special epoxy-modified silicone oil has remained above 47% for three consecutive years. Traditional low-to-medium end products have been completely unable to match the extreme performance requirements of downstream, making the full-process technological upgrading at the industrial end extremely urgent.
The core technological breakthroughs of this new generation of full-series production line cover the full-process links from basic monomer pretreatment to finished product post-treatment. On the raw material side, the new multi-stage coupled low-temperature adsorption + ion exchange deep purification process increases the purity of basic raw materials such as hydrogen-containing polysiloxane and alkenyl epoxy ether to 99.997%, controlling the impurities such as chloride ions, metal ions and free epoxy groups in the raw materials below 0.4ppm, 2ppb and 0.9ppm respectively, avoiding the problems of premature ring opening of epoxy groups and excessive chlorine content of products caused by impurities from the source. In the grafting reaction stage, the independently developed supported platinum-based directional catalytic system realizes 100% fixed-point grafting of epoxy functional groups on the polysiloxane main chain. The atomic utilization rate of the reaction is increased from 38% of the traditional process to 99.7%, completely eliminating the generation of a large number of epoxy group ring-opening by-products in traditional processes. The regulation accuracy of epoxy value of the product reaches ±0.01mol/100g, far higher than the industry average of ±0.08mol/100g in traditional processes, completely solving the long-standing industry pain point of "large batch crosslinking performance fluctuation and low proportion of effective active ingredients". In the post-treatment link, the 14-stage high-vacuum thin-film evaporation coupled with supercritical carbon dioxide extraction deep removal system controls the hydrolyzable chlorine content of the product below 2ppm, far lower than the industry average of 35ppm in traditional processes, even better than the 5ppm control standard of overseas top-tier similar products, completely solving the long-standing industry problem of high-end downstream electronic equipment that chlorine migration easily leads to chip circuit corrosion and long-term service reliability decline. At the same time, the new closed-loop by-product full-recovery circulation system converts all trace unreacted monomers generated in the production process into basic raw materials that can re-enter the synthesis process, reducing waste discharge by 99.4%, energy consumption per unit product by 73%, and organic waste gas emission by 98.5%. While greatly improving product quality, it also achieves the industrial upgrading goal of green and low-carbon production, fully meeting the development requirements of China's high-end chemical new material industry under the "dual carbon" goal.
The most direct value brought by technological upgrading is the performance breakthrough in core downstream application scenarios. In the field of advanced Chiplet chip packaging, the new generation of low-chlorine high-activity epoxy-modified silicone oil is used to prepare underfill adhesives. The crosslinking curing time at 150℃ high temperature is shortened by 42%, and the dielectric constant of the cured colloid is stably maintained at 2.6%. After 12000 extreme temperature cycles from -55℃ to 220℃, the adhesion strength retention rate between the colloid and the chip silicon substrate exceeds 95%, which can greatly reduce the signal transmission loss of 3D stacked chips, increase the overall data transmission rate of Chiplet chips by 31%, and extend the long-term service life of chips from 80000 hours to 150000 hours, fully meeting the mass production demand of domestic advanced Chiplet chips. Previously, such high-end packaging substrates were completely dependent on imports. The implementation of domestic products directly reduces the comprehensive production cost of China's advanced Chiplet underfill adhesives by 51%, further consolidating the independent controllability of China's advanced packaging industrial chain. In the packaging scenario of third-generation semiconductor silicon carbide power devices, high-toughness low-stress epoxy-modified silicone oil is used as potting filling medium, which can quickly export heat when the device operates at high frequency and high power, and greatly reduce the thermal stress impact caused by temperature changes, increasing the long-term service reliability of silicon carbide devices by 38%, greatly extending the service life of on-board power modules for new energy vehicles and reducing the later maintenance cost of new energy vehicles.
In the field of new-generation flexible displays, the specially modified high-adhesion epoxy-modified silicone oil is used as the hard coating of the flexible cover plate. The surface pencil hardness of the coating reaches 6H, while maintaining excellent bending resistance. After 20000 bending tests with a radius of 1mm, there are no cracks or peeling on the coating surface, which can greatly improve the scratch resistance of the foldable screen mobile phone screen, increase the overall service life of flexible display equipment by 45%, and has been batch applied in the new-generation foldable screen products of multiple leading domestic consumer electronics brands at present. In the field of new energy vehicle power batteries, the high-thermal-conductivity epoxy-modified silicone oil is used as the toughening component of structural adhesives. While improving the adhesion strength of structural adhesives, it can increase the thermal conductivity of the colloid to 2.3W/(m·K), greatly accelerate the heat dissipation speed of power batteries, increase the thermal runaway trigger temperature of power batteries by 42℃, significantly improve the battery safety performance of new energy vehicles, and has been batch applied in the new-generation mass-produced models of multiple mainstream domestic power battery enterprises at present. In the field of high-end aerospace composite materials, low-dielectric epoxy-modified silicone oil is used as the interface modifier of carbon fiber composite materials, which can greatly improve the interface bonding strength between carbon fiber and epoxy resin matrix, increase the overall interlaminar shear strength of composite materials by 29%, and reduce the dielectric loss of composite materials, fully meeting the performance requirements of new-generation large aircraft fuselage composite materials, and has been batch applied in the mass-produced components of multiple new domestic civil large aircraft at present.
With the gradual release of domestic high-end production capacity, the market supply structure of epoxy-modified silicone oil is undergoing fundamental changes. In the past two years, China's epoxy-modified silicone oil industry has gradually bid farewell to the extensive low-end capacity expansion model. A large number of small and medium-sized production capacities with substandard environmental protection and backward technical levels have exited in an orderly manner. The industry concentration has continued to increase, and resources are accelerating to gather in leading enterprises with full-chain R&D strength. In 2026, the market size of epoxy-modified silicone oil core raw materials in China is expected to exceed 22 billion yuan, among which the market share of special high-end epoxy-modified silicone oil will further increase to 68%, and the localization rate of high-end products is expected to exceed 88% by the end of the year. At the global market level, the global market size of epoxy-modified silicone oil core raw materials in 2026 is about 6.7 billion US dollars, and it is expected to grow to 19.2 billion US dollars at a compound annual growth rate of 12.1% from 2026 to 2035. As the world's largest emerging market for epoxy-modified silicone oil, China is gradually shifting from product import to independent supply and technology output, occupying a more core position in the global special organic silicone new material industrial chain. Some domestic high-end epoxy-modified silicone oil products have begun to be exported to Europe, North America and other markets in batches, and have been recognized by overseas users with their excellent performance and stable supply capacity.
Industry experts point out that the full-series technological breakthrough and capacity implementation of high-activity low-chlorine epoxy-modified silicone oil is another landmark event for China's special organic silicone functional material industry to shift from "general-purpose scale leadership" to "full-chain independent control of key basic materials". In the past, China's organic silicone industry long focused on the scale expansion of end products, and was restricted by others in the field of epoxy-modified silicone oil, a key functional substrate connecting the upstream and downstream, for a long time. The full-process independent control of technology this time not only directly reduces the production cost of dozens of downstream high-end electronic new materials, but also opens up the full industrial chain technical barriers from basic silicon ore raw materials and synthetic monomers to high-end electronic end products, opening up a new space for subsequent innovation of the entire industry. In the future, with the continuous iteration of downstream emerging industries, high-purity epoxy-modified silicone oil will also achieve application breakthroughs in more cutting-edge scenarios such as quantum chip packaging media, 6G communication high-frequency circuit board coatings and insulating protective layers for controllable nuclear fusion devices, providing solid underlying material support for the high-quality development of multiple strategically emerging industries in China.
