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In the third quarter of 2026, heavy progress has been made in the field of domestic special organosilicon materials: a full-spectrum electronic-grade epoxy modified silicone oil continuous production unit with a designed annual capacity of 32,000 tons successfully completed a 216-hour full-load steady-state operation assessment, and the first batch of products was officially delivered to core downstream users in fields such as semiconductor packaging, new energy power batteries and high-end composite materials. The series of epoxy silicone oil products produced by this unit cover the full range of epoxy group molar content from 1.2% to 22%, and the epoxy value can be precisely adjusted within the range of 0.02mol/100g to 0.45mol/100g. Products with different functional group distributions such as molecular chain terminal epoxy, side chain epoxy and double-terminal epoxy have all achieved stable mass production. Among them, the low-chlorine high-activity grade for semiconductor underfill has a total residual chloride ion of less than 1.2ppm, and the viscosity deviation at 25°C is controlled within ±3%. The shear strength after curing is 42% higher than that of products produced by traditional batch processes, and all core performance indicators have reached the international advanced level. This achievement marks that China has completely broken the 28-year technological monopoly of overseas enterprises on high-end electronic-grade epoxy silicone oil, providing fully independent and controllable core basic material support for key national strategic fields such as advanced semiconductor packaging, new energy power battery sealing and 5G communication device potting.
Epoxy modified silicone oil is a type of reactive special organosilicon intermediate formed by introducing epoxy groups at the terminal or side chain of the polysiloxane molecular chain. By replacing part of the methyl groups of traditional methyl silicone oil with glycidyl epoxy or alicyclic epoxy groups, it simultaneously endows the material with the high and low temperature resistance, low surface tension and electrical insulation properties of organosilicon, as well as the advantages of high reactivity, strong adhesion and low curing shrinkage of epoxy groups. It is a special modified organosilicon material that cannot be replaced by ordinary methyl silicone oil or phenyl silicone oil. In the field of advanced semiconductor packaging, traditional epoxy packaging materials have the pain points of high internal stress, easy cracking and poor thermal shock resistance. As the core toughening modification component, epoxy modified silicone oil can greatly reduce the curing internal stress of the underfill, and increase the thermal shock cycle life of chip packaging from less than 500 times to more than 2500 times in the temperature range of -40°C to 125°C. It is an indispensable key raw material in the 2.5D/3D advanced packaging process. In the field of new energy power batteries, the low surface tension sealant prepared from epoxy silicone oil can form a dense flexible bonding layer at the interface between the metal and insulating material of the power battery shell, and has excellent electrolyte corrosion resistance and thermal conductivity, greatly improving the sealing reliability of power batteries under extreme working conditions. In the field of 5G communication devices, alicyclic epoxy modified silicone oil, as the matrix component of optical module potting materials, can maintain stable dielectric constant and optical transmittance in a wide temperature range of -55°C to 180°C, fully meeting the long-term service requirements of high-frequency and high-speed communication devices.
Over the past two decades, the domestic epoxy silicone oil industry has long stayed in the stage of medium and low-end small-batch production, and has been unable to break through three common industry technical bottlenecks. The first is the problem of directional and controllable grafting of epoxy groups: under the traditional batch hydrosilylation process, the grafting position of epoxy groups on the polysiloxane molecular chain is highly random, which is very likely to cause local epoxy group enrichment or insufficient grafting rate. The epoxy value fluctuation range of epoxy silicone oil produced by domestic traditional processes has long been higher than ±15%, and some batches even contain a large number of unreacted double bond by-products, directly leading to unstable performance of downstream cured materials. The second is the problem of low-ion residual purification: epoxy groups are prone to ring-opening side reactions at high temperatures. Traditional high-temperature distillation processes will cause epoxy ring-opening to generate hydroxyl groups, and cannot effectively remove trace chloride ions and platinum metal catalyst ions remaining during the synthesis process. The total residual chloride ion of domestic traditional products is generally higher than 35ppm, which completely cannot meet the stringent requirements of electronic-grade materials in the field of semiconductor packaging. The third is the problem of precise regulation of functional group distribution. The traditional batch reaction system cannot accurately distinguish the reaction activity difference between terminal groups and side chains, and it is difficult to stably produce customized products with different functional group distributions such as double-terminal epoxy, single-terminal epoxy and side chain random epoxy. High-end customized grades have long relied on imports, and the delivery cycle of some special epoxy silicone oil for aerospace can be as long as 18 months, which has seriously restricted the upgrading process of China's advanced packaging, new energy and other downstream industries.
The new continuous production system that has achieved full production this time has corely overcome three technical barriers that have plagued the global epoxy silicone oil industry for decades. First, the microchannel coupled hydrosilylation directional grafting technology was pioneered. The R&D team abandoned the production idea of traditional batch reactors, and independently developed a 128-stage microchannel series reaction system. By precisely controlling the temperature, pressure and material residence time of different reaction units, epoxy groups are directionally grafted on the polysiloxane molecular chain. From the source of the reaction, the deviation of the epoxy group grafting position is controlled below 0.5%, and the final product has an epoxy value fluctuation range of less than ±2%, completely eliminating the problem of a large number of unreacted double bond by-products in traditional processes. Second, the world's first 12-stage low-temperature coupled purification system for epoxy silicone oil systems has been built. Aiming at the industry pain point that epoxy groups are prone to ring-opening at high temperatures, the team innovatively adopted a combined process of "multi-stage low-temperature thin-film evaporation + inert gas stripping devolatilization + nano-adsorption deep ion removal". The operating temperature throughout the process is strictly controlled below 85°C, which completely avoids the ring-opening side reaction of epoxy groups. The total residual chloride ion in the final product is less than 1.2ppm, and the residual platinum metal ion is less than 0.1ppb, reaching the world's top electronic-grade material purity standard. Third, a full-process functional group real-time online detection system has been built. The entire unit, covering monomer pretreatment, addition reaction, purification and separation, and finished product blending, is equipped with online infrared spectroscopy and online gel permeation chromatography detection modules. The system samples and analyzes the epoxy value, molecular weight distribution and functional group distribution of the reaction system in real time every 1.2 seconds. Once there is a tiny deviation in the parameters, the system automatically completes dynamic parameter adjustment, completely eliminating the batch performance difference of traditional batch processes, realizing zero performance drift of products from different batches across 48 months.
At present, this independently developed full-spectrum electronic-grade epoxy silicone oil has completed long-term industrial application verification for more than 36 months in multiple national strategic core fields. In the field of 2.5D/3D advanced packaging, the underfill modified with this product has a shear strength of 28MPa after curing, no cracking or delamination after 2500 thermal shock cycles. Related products have been batch applied to domestic high-end chip packaging production lines. In the field of new energy power batteries, the shell sealant prepared with this product as the core has a mass change rate of less than 0.3% after 1000 hours of 60°C electrolyte immersion test, and the adhesive strength retention rate is greater than 92%. It has been fully applied to the large-scale production of new generation long-range power batteries. In the field of 5G optical communication, the potting material prepared from alicyclic epoxy modified silicone oil has a stable dielectric constant of 2.8±0.02 and a dielectric loss of less than 0.003 at 10GHz high frequency, fully meeting the high-frequency performance requirements of next-generation 6G communication devices. In the field of special composite materials, epoxy silicone oil, as a toughening agent for epoxy resin, can increase the impact toughness of carbon fiber composite materials by 65% while keeping the tensile strength of the materials basically unchanged. Related raw materials have been applied to the formula system of composite materials for aerospace structural parts.
According to the latest industry operation monitoring data, the domestic market demand for electronic-grade epoxy silicone oil in 2026 increased by 272% year-on-year compared with the same period in 2025. With the official launch of this domestic continuous production line, the market pattern where overseas products have long monopolized the market has been completely broken. The market purchase price of electronic-grade epoxy silicone oil has dropped by 73% year-on-year, and the delivery cycle for core downstream users has been greatly shortened from the original 18 months to less than 3 days. With the subsequent start of construction of the second production line of the same scale, it is expected that by 2030, the global market share of domestically produced high-quality epoxy silicone oil will exceed 82%. It will not only fully meet the upgrading needs of domestic downstream industries such as advanced semiconductor packaging, new energy power batteries and 5G communication, but also greatly enhance the core voice of China's high-end epoxy silicone oil special intermediates in the global new material industrial chain.
