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In July 2026, a landmark progress was announced in China's electronic materials sector: the ultra-high-purity electronic-grade epoxy silicone oil tailored for high-frequency dielectric coating scenarios in AI computing centers has officially completed continuous stable operation verification across the entire mass production line. All core performance indicators of the product have reached the world's top level, completely breaking the nearly 20-year technological monopoly of overseas enterprises in this niche field. This breakthrough not only fills the domestic industry gap in high-end special organosilicon materials, but also directly provides fully independent and controllable core material support for key industrial chain links such as domestic AI server packaging, semiconductor chip manufacturing, and new energy vehicle high-voltage insulation.
Epoxy silicone oil is a modified organosilicon fluid with epoxy active groups introduced into the side chains or terminal positions of the polysiloxane molecular backbone. It simultaneously integrates the advantages of organosilicon materials including wide temperature resistance, low surface tension and high insulation, as well as the high reactivity and strong adhesion characteristics of epoxy groups. It serves as a critical intermediate hub connecting basic organosilicon raw materials and downstream high-end functional materials. Unlike ordinary industrial-grade epoxy silicone oil, the technical barriers of electronic-grade products are highly concentrated in two dimensions: extreme impurity control and precise molecular structure regulation. Previously, the domestically mass-produced ordinary epoxy silicone oil generally had shortcomings such as epoxy group conversion rate below 85%, free chlorine residue exceeding 5ppm, and total metal ion content higher than 2ppm, which completely failed to meet the strict requirements of semiconductor and AI computing scenarios. For a long time, downstream high-end applications could only rely on expensive imported products, posing huge hidden risks to supply chain security.
The full-process process innovation completed by domestic technical teams this time has realized the ten-thousand-ton industrial-scale implementation of the titanium-silicon molecular sieve catalyzed direct hydrogen peroxide oxidation technology for the first time, completely replacing the traditional highly polluted chlorohydrin synthesis route. By introducing an in-situ passivation separation unit into the reaction system, the inhibition rate of ring-opening side reactions of epoxy groups has been increased to over 99%, and the epoxy group conversion rate of the final product has stably reached 94%, with the free acid value controlled below 0.008mgKOH/g, far better than the international general standard line of 0.015mgKOH/g. In the purification section, the team innovatively adopted a multi-stage molecular distillation coupled with supercritical fluid extraction process to achieve deep removal of trace residual chlorine elements, metal ions and low-molecular cyclic siloxanes in the product. The final produced electronic-grade epoxy silicone oil has a total metal ion content of less than 0.3ppm, and the volatile content is only 0.12% after constant-temperature baking at 150°C for 72 hours, fully meeting the "zero impurity" requirements of semiconductor manufacturing for electronic chemicals.
At present, this domestically produced electronic-grade epoxy silicone oil has completed 6 consecutive months of batch application verification on multiple domestic advanced packaging production lines. Actual measurement data shows that the chip underfill adhesive prepared with this material still shows no cracking or delamination after 1000 cycles in the thermal shock test from -65°C to 180°C, improving the reliability of chip packaging by 40%. When added as a modified component to the high-frequency dielectric coating of PCBs in AI computing servers, it can reduce the dielectric loss of the coating to 0.0023 at the 100GHz frequency band, cutting the signal transmission delay by 18% compared with traditional materials, perfectly adapting to the extreme demand of current AI large model training clusters for high-speed data transmission. In the motor insulation impregnation scenario of the 800V high-voltage platform for new energy vehicles, the insulating resin modified with this epoxy silicone oil has a breakdown strength of 28kV/mm. Under long-term continuous operation at 180°C, the insulation life is 3 times longer than that of the traditional epoxy system, completely solving the insulation aging problem of high-voltage platforms during long-term operation.
The latest market data released by industry research institutions shows that in the first half of 2026, the market demand for domestic electronic-grade epoxy silicone oil increased by 168% year-on-year compared with 2025. The market pattern that was 100% dependent on imports before has rapidly transformed, with domestically produced materials occupying 37% of the market share following this domestic technological breakthrough. The procurement cost for downstream core users has directly decreased by 52%, and the supply chain delivery cycle has been shortened from the original 3 months to less than 7 days. With the subsequent continuous expansion of production lines, it is expected that the market penetration rate of domestically produced electronic-grade epoxy silicone oil will exceed 80% in 2027, completely realizing full independent control of this type of core material and building a solid material foundation for the development of strategic emerging industries such as domestic AI computing, advanced semiconductors and new energy vehicles.
